Ray, Ajoy K and Kar, Abhijit and Ghosh, M (2007) Microstructural characterization of tin lead and lead free solder joint interface. In: Inter. Symp. on Advanced Materials and Processing, ISAMP-2007, 29-30 Oct. 2007, Basaveshwar Engineering College, Bagalkot..
![[thumbnail of mghosh-4.pdf]](http://eprints.nmlindia.org/style/images/fileicons/application_pdf.png "mghosh-4.pdf")
mghosh-4.pdf
Download (1MB)
Abstract
Interface of Cu-(Sn37Pb) and Cu-(Sn3.5Ag0.5Cu) soldered joints has been characterized by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) fitted with EDX. TEM analysis. The presence of different intermetallic compounds (IMCs) in the interface, such as (Cu 6 Sn 5 ), (Cu 3 Sn) and Ag 3 Sn phases have been confirmed. Microstructural observations are correlated with the electrical and mechanical properties of the joints. (Lead free solder)-Cu joint exhibits better electrical conductivity (0.28x10 6 ohm-1 cm-1) and mechanical strength ~68MPa compare to the conventional (lead-tin solder)-Cu joint which exhibits electrical conductivity and mechanical strength as 0.22x10 6 ohm-1cm-1 and ~55MPa respectively.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | Interface, Lead free solder, TEM, electrical conductivity |
| Subjects: | Materials Science |
| Divisions: | Material Science and Technology |
| Depositing User: | Dr. A K Sahu |
| Date Deposited: | 04 Jul 2012 04:44 |
| Last Modified: | 03 Sep 2026 07:03 |
| URI: | http://eprints.nmlindia.org/id/eprint/5687 |
Actions (login required)
- View Item