Items where Subject is "Metallurgy > Alloys and Compounds > Copper Alloys"
Group by: Creators | Item Type
Number of items at this level: 7.
Gupta, M K and Banerjee, T (1962) Thermal and electrical conductivity of copper manganese alloys. Other (TMP). CSIR NML.
Meshram, Pratima and Bhagat, Lalit and Prakash, U and Pandey, B D and Abhilash, (2017) Organic acid leaching of base metals from copper granulated slag and evaluation of mechanism. Canadian Metallurgical Quarterly , 56(2) (IF -0.596). pp. 168-178.
Nanda, T and Ravi Kumar, B and Sharma, S and Singh, V and Pandey, O P (2017) Effect of thermal cycling process parameters on recrystallization kinetics for processing of fine-grained pure copper. Materials and Manufacturing Processes, 32(1) (IF-2.274). pp. 34-43.
Roy, Rajat K and Panda, A K and Das, Swapan K and Govind, and Mitra, A (2009) Development of a copper-based filler alloy for brazing stainless steels. Materials Science and Engineering A, 523 (1-2). pp. 312-315.
Roy, Rajat K and Singh, Satnam and Gunjan, M K and Panda, A K and Mitra, A (2011) Joining of 304SS and pure copper by rapidly solidified Cu-based braze alloy. Fusion Engineering and Design, 86 . pp. 452-455.
Srivastava, V C and Scheider, A and Uhlenwinkel, V and Ojha, S N and Bauckhage, K (2004) Age-hardening characteristics of Cu–2.4Ni–0.6Si alloy produced by the spray forming process. Journal of Materials Processing Technology, 147 . pp. 174-180.
Srivastava, V C and Schneider, A and Uhlenwinkel, V and Bauckhage, K (2004) Effect of thermomechanical treatment on spray formed Cu–Ni–Si alloy. Materials Science and Technology, 20 . pp. 839-848.