Items where Subject is "Metallurgy > Alloys and Compounds > Copper Alloys"

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Number of items at this level: 9.


Gupta, M K and Banerjee, T (1962) Thermal and electrical conductivity of copper manganese alloys. Other (TMP). CSIR NML.

Gupta, R N P and Verma, M N P and Rao, G N (1970) Moulding sand available near Batala and their suitability for copper alloy castings. Other (TMP). CSIR-NML, Jamshedpur.


Meshram, Pratima and Bhagat, Lalit and Prakash, U and Pandey, B D and Abhilash, (2017) Organic acid leaching of base metals from copper granulated slag and evaluation of mechanism. Canadian Metallurgical Quarterly , 56(2) (IF -0.596). pp. 168-178.


Nanda, T and Ravi Kumar, B and Sharma, S and Singh, V and Pandey, O P (2017) Effect of thermal cycling process parameters on recrystallization kinetics for processing of fine-grained pure copper. Materials and Manufacturing Processes, 32(1) (IF-2.274). pp. 34-43.


Roy, Rajat K and Panda, A K and Das, Swapan K and Govind, and Mitra, A (2009) Development of a copper-based filler alloy for brazing stainless steels. Materials Science and Engineering A, 523 (1-2). pp. 312-315.

Roy, Rajat K and Singh, Satnam and Gunjan, M K and Panda, A K and Mitra, A (2011) Joining of 304SS and pure copper by rapidly solidified Cu-based braze alloy. Fusion Engineering and Design, 86 . pp. 452-455.


Shivam, V and Kar, S and Mandal, G K and Srivastava, V C (2023) Microstructural evolution and phase selection during solidification of AlCrCuFeNi high entropy alloy. Journal of Alloys and Compounds, 963 .

Srivastava, V C and Scheider, A and Uhlenwinkel, V and Ojha, S N and Bauckhage, K (2004) Age-hardening characteristics of Cu–2.4Ni–0.6Si alloy produced by the spray forming process. Journal of Materials Processing Technology, 147 . pp. 174-180.

Srivastava, V C and Schneider, A and Uhlenwinkel, V and Bauckhage, K (2004) Effect of thermomechanical treatment on spray formed Cu–Ni–Si alloy. Materials Science and Technology, 20 . pp. 839-848.

This list was generated on Thu Jun 13 06:21:13 2024 IST.