Reclamation of Copper from Electronic Industry Effluent Using Plant Root Adsorbent

Kalamani Bawkar, Shilpa and Hait, Jhumki and Choubey, Pankaj K and Panda, Rekha and Singh, Pramod Kumar and Jha, Manis K (2022) Reclamation of Copper from Electronic Industry Effluent Using Plant Root Adsorbent. Journal of Metallurgy and Materials Science .



Copper ion contamination in electronic industrial effluent is an universal issue. The traditional way of copper removal from effluent have some disadvantages like expensive operational cost, sludge generation after water treatment. Adsorption technique for copper(II) using synthetic adsorbent is one of the efficient ways of water treatment but it is expensive on a commercial scale. Due to this, researcher across the globe is looking after to find the efficient, economical, and readily available biomass-based adsorbent for metal recovery. The present study was intended for adsorption of copper on to Datura ( ) root powder using batch studies. It was found to be one of the efficient bioadsorbent with 947 mg/g copper adsorption capability. Batch experiments were performed by using 4 g/L of Datura root powder kept in contact with 100 ppm copper containing industrial effluent in 15 min contact time at pH 4. The result indicates 95% copper adsorption on the surface of Datura root powder. Kinetic study indicates that experimental data fit well in pseudo second order rate reaction and follows Freundlich isotherm indicating multilayer adsorption process. FT-IR result indicates involvement of aromatic group (Phosphates) of Datura root binding with copper ions. Elution experiments were performed using 10% H SO in 60 min to remove copper from loaded adsorbent. High copper adsorption capacity and its regeneration efficiency of Datura root powder suggest its applicability in copper reclamation from electronic industrial effluent.

Item Type:Article
Official URL/DOI:
Uncontrolled Keywords:Bioadsorbent, Datura Root Powder, Heavy Metals, Industrial Effluents, Copper
Divisions:Metal Extraction and Forming
ID Code:9378
Deposited By:Dr. MK Jha
Deposited On:03 Oct 2023 15:55
Last Modified:03 Oct 2023 15:55

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