Corrosion protection of ENIG surface finishing using electrochemical methods

Bui, Q V and Nam, N D and Choi, D H and Lee, J B and Lee, C Y and Kar, Abhijit and Kim, J G and Jung, S B (2010) Corrosion protection of ENIG surface finishing using electrochemical methods. Materials Research Bulletin, 45 (3). pp. 305-308.

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Four types of thin film coating were carried out on copper for electronic materials by the electroless plating method at a pH range from 3 to 9. The coating performance was evaluated by electrochemical impedance spectroscopy and potentiodynamic polarization testing in a 3.5 wt.% NaCl solution. In addition, atomic force microscopy and X-ray diffraction were also used to analyze the coating surfaces. The electrochemical behavior of the coatings was improved using the electroless nickel plating solution of pH 5. The electroless nickel/immersion gold on the copper substrate exhibited high protective efficiency, charge transfer resistance and very low porosity, indicating an increase in corrosion resistance. Atomic force microscopy and X-ray diffraction analyses confirmed the surface uniformity and the formation of the crystalline-refined NiP {1 2 2} phase at pH 5.

Item Type:Article
Official URL/DOI:
Uncontrolled Keywords:Electronic materials; Atomic force microscopy; X-ray diffraction;Impedance spectroscopy; Surface properties
Divisions:Material Science and Technology
ID Code:481
Deposited By:Sahu A K
Deposited On:13 May 2010 09:42
Last Modified:13 Dec 2011 16:39
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