Kar, Abhijit and Ghosh, M and Majumdar, Bhaskar S and Ghosh, R N and Ray, Ajoy K (2007) Interfacial microstructure, shear strength and electrical conductivity of Sn-3 center dot 5Ag-o center dot 5In/Cu lead free soldered joints. Materials Technology, 32 (3). pp. 161-165.
Full text not available from this repository.
A Sn-Ag-In ternary alloy was considered as a substitute for eutectic Sn-Pb solder in the joining of electronic components. The microstructure in the diffusion zone of the assemblies was examined by scanning electron microscopy and the presence of CU6Sn5 intermetallics was confirmed by transmission electron microscopy. The width of brittle intermetallic phases present at the interface was found to control the strength of the solder joint. Sn-3.5Ag-0.5In/Cu joints exhibited better mechanical and electrical properties than Sn-37Pb/Cu joints.
|Official URL/DOI:||DOI: 10.1179/175355507X236632|
|Uncontrolled Keywords:||lead free solder; interfacial bonding; shear strength; electrical conductivity; soldering; intermetallic phases|
|Divisions:||Material Science and Technology|
|Deposited By:||INVALID USER|
|Deposited On:||15 Jul 2011 16:28|
|Last Modified:||19 Jan 2012 16:17|
Repository Staff Only: item control page