Effect of basis metals and different solvents on deposition of nickel

Effect of basis metals and influence of solvents on electrodeposition of nickel had been investigated. The nature of the basis metal did not have much effect on the cathode efficiency and micro-hardness of the deposit, whereas the substrate surface was found to affect the mode of deposition particularly in case of aqueous bath. CCE was found to increase slightly and micro-hardness noticeably, when deposition was carried out successively in 5 mol % formamide (FA)-water, 5 mol % N-methylformamide(NMF)-water and 5 mol % N, N-dimethylformamide (DMF)-water mixture instead of an aqueous bath. Pits and crack structure exhibited in case of deposits obtained from an aqueous bath were successively suppressed when electrodeposition was tried with 5mol % FA-water, 5 mol % NMF-water and 5 mol % DMF-water mixture irrespective of the nature of basis metals (i.e, brass, copper or copper-deposited copper). These results have been explained on the basis of the filling of structural cavities as well as amide-water associates by means of interaction between the components of the mixed solvent. Under similar conditions, brass substrate electroplates exhibited less cracks and pits than copper.