Recovery of Sn, Ag and Cu from Waste Pb-Free Solder using Nitric Acid Leaching

Yoo, Kyoungkeun and Lee, Jae-chun and Lee, Kwang Seok and Kim, Byung-Su and Kim, Min-seuk and Kim, Soo-kyoung and Pandey, B D (2012) Recovery of Sn, Ag and Cu from Waste Pb-Free Solder using Nitric Acid Leaching. Materials Transactions, 53 (12). pp. 2175-2180.

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The development of a hydrometallurgical process for the recycling of waste Pb-free solder based on nitric acid leaching, followed by the separation of Ag and Cu through AgCl precipitation or cementation, was investigated. Nitric acid dissolved Cu and Ag from the waste material while converting tin to stannic oxide (SnO2), which is very sparingly soluble in the HNO3 solution. More than 99% of the Ag and Cu in the waste Pb-free solder were dissol-ved in 2 kmol·m¹3 HNO3 under the leaching conditions of 75°C, 100 kg·m¹3 pulp density and stirring at 400 rpm for 120 min. The addition of NaCl or Cu powder was used to separ-ate Ag from Cu in the solution. The addition of 2 kg·m¹3 of NaCl or 125 kg·m¹3 of Cu powder to the leaching solut-ion at 30°C led to the successful recovery of 3755 g·m¹3 of Ag. Thus, the results showed that Sn, Ag and Cu could be separated and recovered from waste Pb-free solder by the proposed recycling process.

Item Type:Article
Official URL/DOI:
Uncontrolled Keywords:lead-free solder, tin, silver, nitric acid leaching, recycling
Divisions:Metal Extraction and Forming
ID Code:6225
Deposited By:Sahu A K
Deposited On:30 Nov 2012 17:55
Last Modified:18 Jun 2018 11:47
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