Bui, Q V and Nam, N D and Yoon, J W and Choi, D H and Kar, Abhijit and Kim, J G and Jung, S B (2011) Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish. Journal of Electronic Materials, 40 (9). pp. 1937-1942.
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Abstract
The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.
| Item Type: | Article |
|---|---|
| Official URL/DOI: | http://www.springerlink.com/content/v2g632742r8140... |
| Uncontrolled Keywords: | Electronic materials; NiP; gold; corrosion resistance |
| Divisions: | Material Science and Technology |
| ID Code: | 3908 |
| Deposited By: | Dr. A K Sahu |
| Deposited On: | 09 Sep 2011 09:59 |
| Last Modified: | 21 Nov 2011 12:02 |
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