Park, Y W and Sankara Narayanan, T S N and Lee, K Y (2007) Effect of temperature on the fretting corrosion of tin plated copper alloy contacts. Wear, 262 (3-4). pp. 320-330.
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Abstract
The effect of temperature on the fretting corrosion behaviour of tin plated copper alloy contacts in the temperature range of 25–185 °C, is addressed in this paper. The change in contact resistance with fretting cycles at various temperatures was determined. The contact zone after fretting corrosion test was analyzed using laser scanning microscope, X-ray diffraction (XRD), scanning electron microscopy (SEM) and X-ray spectrometry (EDX), to assess the surface profile, phase content, morphology and compositional changes across the interface. The study reveals that temperature has a greater influence on the extent of fretting corrosion of tin plated copper alloy contacts. The softening of tin is responsible for the extended region of low contact resistance observed at 85 °C. The increase in thickness and the resistance of Cu–Sn intermetallic compounds (IMCs) is responsible for the decrease in surface roughness and the drastic increase in the contact resistance at higher temperatures. The study suggests that the tin plated copper alloy contact system should be considered as copper alloy/IMC/Sn/SnO2 instead tin plated copper alloy. During fretting corrosion test at elevated temperatures, once the top surface layers are worn out, the contact interface is transformed from tin versus tin-to-tin-intermetallic versus tin-intermetallic. The study concludes that tin plated copper alloy contacts are not suitable for high temperature applications.
Item Type: | Article |
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Official URL/DOI: | http://dx.doi.org/10.1016/j.wear.2006.05.020 |
Uncontrolled Keywords: | Fretting corrosion; Tin plating; Electrical connector; Contact resistance; Intermetallic compound; XRD; SEM; EDX; Surface roughness |
Divisions: | NML Chennai > Chemistry |
ID Code: | 339 |
Deposited By: | Dr. TSN Sankara Narayanan |
Deposited On: | 23 Nov 2009 15:52 |
Last Modified: | 07 Feb 2012 14:49 |
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