Jha, Manis K and Choubey, Pankaj K and Kumari, Archana and Kumar, Rakesh and Kumar, Vinay and Lee, Jae-chun (2011) Leaching of lead from solder material used in electrical and electronic equipment. In: Proceedings of second symposium on Recycling of waste II, 2011, Recycling of waste II.
Present work is a part of developing novel recycling tec-hnique for waste printed circuit boards (PCBs) i.e. the liberation of metals from PCBs by organic swelling follow-ed by the treatment of resin to remove/ recover hazardous soldering materials. In order to recover the hazardous metallic constituent lead from the liberated resin, init-ially the leaching studies were made using fresh solder co-ntaining 63.9% Pb and remaining tin. Experimental results obtained in different conditions viz. time,temperature and acidity showed ~97.20% of lead dissolution with 6M HNO3 at solid to liquid (S:L) ratio 1:10 (g/mL) and temperature 90oC in 75 minutes. The result of the studies validated with crushed PCBs shows that almost total lead and tin was leached out with 6M HNO3 and 6M HCl respectively at S:L ratio 1:10 (g/mL) and temperature 90oC within 50 minutes. The results will be useful for the treatment and safe dis-posal of PCBs resin.
|Item Type:||Conference or Workshop Item (Paper)|
|Uncontrolled Keywords:||Lead, Tin, Solder, Leaching|
|Divisions:||Metal Extraction and Forming|
|Deposited By:||Dr. A K Sahu|
|Deposited On:||06 Jun 2011 16:07|
|Last Modified:||29 Nov 2011 13:56|
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