Roy, Rajat K and Panda, A K and Das, Swapan K and Govind, and Mitra, A (2009) Development of a copper-based filler alloy for brazing stainless steels. Materials Science and Engineering A, 523 (1-2). pp. 312-315.
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Abstract
The filler alloy of nominal composition Cu–40Mn–10Ni (all in wt%) was prepared in the form of ribbon of 40 μm thick by melt spinning technique. The ribbon exhibits narrow melting zone and comprise single phase of Cu–Mn–Ni solid solution. The melt spun ribbon successfully brazed 304 stainless steel butt joints. The formation of solid solution in the joining area without any intermetallics is observed. The bonding strength of filler alloy is achieved around 456 MPa.
| Item Type: | Article |
|---|---|
| Official URL/DOI: | http://dx.doi.org/10.1016/j.msea.2009.05.049 |
| Uncontrolled Keywords: | Brazing; Rapid solidification; Cu-based brazing alloy; Bond strength; Diffusion; Scanning electron microscopy (SEM) |
| Divisions: | Material Science and Technology |
| ID Code: | 15 |
| Deposited By: | Madhan M |
| Deposited On: | 20 Sep 2009 12:08 |
| Last Modified: | 08 Feb 2012 16:44 |
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