Interface energy studies of some copper-nickel alloys containing a liquid phase

Halder, B and Prakash, Ved (1962) Interface energy studies of some copper-nickel alloys containing a liquid phase. NML Technical Journal, 4 (3). pp. 13-17.

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Abstract

The effect of nickel additions on the dihedral angle of copper vs. liquid lead and bismuth has been investigated. It has been shown that additions of nickel up to 40% increase the copper-liquid bismuth dihedral angle from 0°C to 75°C. The same additions of nickel have no marked effect on the copper-liquid lead dihedral angle. (Mr. B. Halder, Senior Scientific Assistant and Mr. Ved Prakash, Senior Scientific Officer, National Metallurgical Laboratory, Jamshedpur)

Item Type:Article
Official URL/DOI:http://library.nmlindia.org/articleDetails.jsp?rec...
Uncontrolled Keywords:liquid lead; bismuth; nickel; dihedral angle of copper; copper-liquid lead dihedral angle
Divisions:Director Office
ID Code:1464
Deposited By:Dr. A K Sahu
Deposited On:10 Aug 2010 17:26
Last Modified:14 Feb 2012 16:11
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