Roy, Rajat K and Panda, A K and Mitra, A (2013) Microstructure Evolution and Bonding Strength of Brazed Joint of Stainless Steel and Copper. Indian Welding Journal, 46(1). pp. 1-5.
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Abstract
The joining behaviour between stainless steel and copper has an importance in scientific and engineering
applications such as high energy ring vacuum chambers and International Thermonuclear Fusion Experiment
Reactor (ITER). In this research, the rapidly solidified foils of nominal composition 50Cu-40Mn-10Ni (C50) are
used as a filler alloy for brazing between stainless steel (304 SS) and copper (Cu) plates. It is examined that
C50 foil makes a good contact joint between two dissimilar metal plates of different thermal conductivities.
The brazed region is mostly free from any porosities and intermetallic compounds, emphasizing on the
distribution of solid solution phases. It causes high bonding strength of 304 SS-Cu butt joint at low brazing
O temperature (B =920 C) with a fracture at the joint area. On the other hand, the fracture occurs at Cu base T
metal for B = 980°C. The fractography also shows the presence of several dimples at Cu substrate and T
severely deformed region at stainless steel substrate, representing a good quality bonding between 304SS and
Cu plates.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Brazing, Diffusion, Electron Microscopy, Solid solution phases, Bonding Strength. |
| Subjects: | Mechanical Engineering |
| Divisions: | Material Science and Technology |
| Depositing User: | Dr Rajat Roy |
| Date Deposited: | 14 Jul 2014 11:58 |
| Last Modified: | 03 Sep 2026 09:11 |
| URI: | http://eprints.nmlindia.org/id/eprint/6967 |
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