Leaching studies for the recovery of metals from the waste printed circuit boards (PCBs)

Jha, Manis K and Shivendra and Kumar, Vinay and Pandey, B D and Kumar, Rakesh and Lee, Jae-chun (2010) Leaching studies for the recovery of metals from the waste printed circuit boards (PCBs). In: Proceedings of TMS-2010, Feb 2010.

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Abstract

Leaching studies were carried out for the recovery/ recycling of metals from PCBs containing 17.05% Cu, 0.74% Ni, 1.74% Fe, 4.35% Pb and 8.32% Sn using various acids such as H2SO4,HCl and HNO3. While sulfuric acid was not a suitable leachant for the dissolution of metals from PCBs, hydrochloric acid selectively dissolved tin. The nitric acid was found to be effective lixiviant with the recovery of 99.99% Cu, Fe, Ni and 36.7% Pb in 6M HNO3 at S/L ratio of 100 g/L and 90oC. The kinetic studies carried out with 2M and 4M HNO3 at 90oC showed “Ash diffusion control dense constant size-spherical particles” model.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Leaching Kinetics, Waste PCBs, Copper, Lead, Tin
Subjects: Waste Management
Divisions: Metal Extraction and Forming
Depositing User: Users 115 not found.
Date Deposited: 06 Jun 2011 14:25
Last Modified: 02 Sep 2026 22:26
URI: http://eprints.nmlindia.org/id/eprint/2975

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