Jha, Manis K and Shivendra and Kumar, Vinay and Pandey, B D and Kumar, Rakesh and Lee, Jae-chun (2010) Leaching studies for the recovery of metals from the waste printed circuit boards (PCBs). In: Proceedings of TMS-2010, Feb 2010.
32_TMS-2010.pdf
Restricted to NML users only. Others may use ->
Download (298kB) | Request a copy
Abstract
Leaching studies were carried out for the recovery/ recycling of metals from PCBs containing 17.05% Cu, 0.74% Ni, 1.74% Fe, 4.35% Pb and 8.32% Sn using various acids such as H2SO4,HCl and HNO3. While sulfuric acid was not a suitable leachant for the dissolution of metals from PCBs, hydrochloric acid selectively dissolved tin. The nitric acid was found to be effective lixiviant with the recovery of 99.99% Cu, Fe, Ni and 36.7% Pb in 6M HNO3 at S/L ratio of 100 g/L and 90oC. The kinetic studies carried out with 2M and 4M HNO3 at 90oC showed “Ash diffusion control dense constant size-spherical particles” model.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | Leaching Kinetics, Waste PCBs, Copper, Lead, Tin |
| Subjects: | Waste Management |
| Divisions: | Metal Extraction and Forming |
| Depositing User: | Users 115 not found. |
| Date Deposited: | 06 Jun 2011 14:25 |
| Last Modified: | 02 Sep 2026 22:26 |
| URI: | http://eprints.nmlindia.org/id/eprint/2975 |

